HY510 Thermal Grease Cooler Paste

KSh500

Key Features:

  • Silicone-based thermal conductive paste
  • Improves CPU and GPU heat dissipation
  • Thermal conductivity ≥ 1.93 W/m·K
  • Non-conductive and safe for electronics
  • Suitable for laptops and desktops
  • Works with heatsinks and cooling systems
  • Easy to apply and spread
The Price and Availability Are Subject to change without Notice.
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HY510 Thermal Grease Cooler Paste
HY510 Thermal Grease Cooler Paste
KSh500
HY510 Thermal Grease Cooler Paste
HY510 Thermal Grease Cooler Paste
KSh500

HY510 Thermal Grease Cooler Paste Price and Features in Kenya

The HY510 Thermal Grease is a cost-effective thermal interface material designed to improve heat transfer between processors and cooling systems. It fills microscopic gaps between the CPU or GPU and the heatsink, helping reduce heat buildup and maintain stable system performance.

Stable Heat Dissipation Performance:

With a thermal conductivity rating of ≥1.93 W/m·K, HY510 helps transfer heat efficiently from electronic components to cooling surfaces. It is widely used in desktops, laptops, gaming consoles, and other electronic devices that require basic to moderate thermal management.

Safe and Non-Conductive Formula:

HY510 is electrically non-conductive, making it safe for use on sensitive electronic components. This reduces the risk of short circuits during application, especially in CPU and GPU installations.

Wide Compatibility:

This thermal paste is suitable for CPUs, GPUs, chipsets, LED modules, and other heat-generating electronic components. It is commonly used in both repairs and general maintenance of computing devices.

Easy Application and Maintenance:

The paste has a smooth consistency that allows easy spreading during installation. For best performance, it should be applied in a thin, even layer to ensure proper heat transfer between surfaces.

Thermal Grease HY510 Cooler Paste Specifications:

Product NameHY510 Thermal Grease
Product TypeSilicone-Based Thermal Conductive Paste
ApplicationCPU, GPU, Chipsets, Laptop Cooling, Heatsinks
Thermal Conductivity≥ 1.93 W/m·K
ColorGrey
Thermal Impedance≤ 0.225 °C·in²/W
Operating Temperature-30°C to 280°C (approx.)
Density> 2.0 g/cm³
Base MaterialSilicone Compound with Metal Oxides
Electrical ConductivityNon-Conductive (safe for electronics)
ConsistencySmooth viscous paste
Viscosity StabilityHigh stability, anti-dry formula (varies by batch quality)
Application MethodManual spreading or pea-size application
CompatibilityDesktop PCs, Laptops, Gaming Consoles, LED chips
StorageCool, dry place
Shelf LifeLong-lasting under proper storage

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